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CK300 Dual-Target Magnetron Sputtering Coating System

This device adopts a single-chamber D-type structure, equipped with two 3-inch magnetron targets and supports DC/RF dual-mode switching. It features an anode ion source-assisted deposition and reverse sputtering cleaning function, with an ultimate vacuum degree of ≤5×10⁻⁵ Pa, suitable for precise preparation and small-batch prototyping of metal, semiconductor, and dielectric films.

Details

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1. Overview of Equipment and Application Fields

The CK300 Dual-Target Magnetron Sputtering Coating System is a high-performance vacuum coating equipment designed for universities, research institutes, and corporate R&D centers. Specifically engineered for the production of nanoscale single-layer films, multilayer composite films, rigid films, metal conductive films, semiconductor films, and optical dielectric films, this system delivers stable vacuum environments and flexible process configurations. Capable of meeting diverse needs ranging from fundamental material research to small-scale sample prototyping, the CK300 stands as a core experimental facility in the field of thin-film technology.

2. Core Functional Highlights

· The dual-target co-deposition system is equipped with two 3-inch permanent magnet magnetron sputtering targets, supporting independent or simultaneous operation in DC and RF power supply modes. Users can flexibly select target materials (metallic or non-metallic) to achieve precise preparation of alloy films, multilayer films, and gradient films.

· Advanced Surface Pretreatment Technology

o Anode layer ion source: Provides high-energy ion beams for deep cleaning of the sample surface prior to plating, removing organic contaminants; simultaneously assists ion deposition during the coating process, significantly enhancing the density and adhesion of the film layer.

o Reverse Sputtering Cleaning: Enables in-situ reverse sputtering on substrates prior to formal coating, effectively removing surface oxide layers and adsorbed gases to ensure optimal adhesion between film and substrate.

· High-precision gas control system integrates two independent MKS mass flow controllers (MFCs), enabling precise ratio and dynamic mixing of high-purity argon with reaction gases (e.g., oxygen, nitrogen). The system continuously monitors and automatically adjusts the chamber pressure to ensure high repeatability and stability of the process.

3. Technical Parameters and Specifications

Parameter item

qualification

vacuum performance

Extreme vacuum: 5×10⁻⁵ Pa

Working vacuum: up to 5×10⁻⁴ Pa

Pressure rise rate: 10 Pa after 12 hours of pump shutdown

System leakage rate: 5×10⁻⁷ Pa·L/S

Power configuration

Equipped with two 600W,13.56MHz RF power supplies (or DC power supply as per configuration), featuring automatic network matching to ensure stable plasma discharge.

cavity structure

Single-compartment D-type front-opening design, high-quality stainless steel material, spacious operating space, and convenient sample replacement

Built-in liner: Removable stainless steel liner, effectively prevents sputtering contamination of chamber walls and reduces maintenance costs

process regulation

Adjustable target base distance: 40mm to 120mm, adaptable to varying requirements for film thickness uniformity

Sample stage: Equipped with optional orbital/rotational sample holder to enhance uniformity of large-area coating

Temperature Control and Baking

Infrared heating system: Supports chamber baking and degassing, with a maximum temperature of 150°C, accelerating to a high vacuum state

security guard

It features interlock protection against water/power failure and overcurrent, along with anti-misoperation logic, ensuring comprehensive operational safety for equipment.

4. Why choose the CK300 dual-target system?

The CK300 Dual-Target Magnetron Sputtering Coating System has become the preferred choice for research laboratories, featuring a cost-effective dual-target configuration, outstanding vacuum performance, and an intelligent control system. Its compact D-shaped design not only saves valuable laboratory space but also simplifies operational procedures through a user-friendly interface. Whether conducting complex oxide film research or developing novel metal multilayer films, the CK300 provides stable and reliable process support, facilitating efficient scientific output.